3D Solder Paste Inspection (SPI)

Introduction

With industry leading speeds of up to 200 cm2/sec, the TR7007 SII Plus is the perfect SPI solution for any production line. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision, reliable linear motor platform, the system’s hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. TRI’s quick and intuitive user interface makes programming simple and easy, bringing maximum value to your production.

TR7007 SII Plus

Featured

• Industry leading inspection speed up to 200 cm²/sec @ 15 µm
• Shadow free Fringe Pattern lighting technology
• Optical resolution 10 µm or 15 µm
• Linear motor X-Y table for stable and accurate inspection
• Advanced SPC functions for production quality monitoring and evaluation.

Specifications

• Camera type		4 MP camera
• Optical resolution		10 µm or 15 µm (factory setting)
• Lighting		LED lit fringe pattern
• Inspection speed		Up to 90 cm²/sec @ 10 µm Up to 200 cm²/sec @ 15 µm
• Inspection performance
。Height resolution		0.4 µm
。Min solder paste pitch		100 µm
• Board size
。TR7007M SII Plus		50 x 50 – 350 x 350 mm
。TR7007 SII Plus		50 x 50 – 510 x 460 mm
。TR7007L SII Plus		50 x 50 – 660 x 610 mm
。TR7007 SII Plus DL		50 x 50 – 510 x 310 mm x 2 lanes 50 x 50 – 510 x 590 mm x 1 lane
• Machine Dimensions (W x D x H)
。TR7007M SII Plus		1000 x 1555 x 1500 mm
。TR7007 SII Plus		1100 x 1570 x 1550 mm
。TR7007L SII Plus		1300 x 1610 x 1560 mm
。TR7007 SII Plus DL		1100 x 1770 x 1560 mm

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